Introduction

Wafer grinding wheels are used in the in-feed grinding process of semiconductor wafers such as TSV package (Cu/compound), SiC, sapphire, Si and reclaimed wafers etc. The in-feed grinding process consists of rough and fine grinding processes. Wafer grinding wheels are made of diamond abrasives and customized vitrified bond in a unique porous microstructure. The diamond size for rough and finish grinding processes are #325～#1000 and #2000～#8000 respectively. The features of these wafer grinding wheels are stable high removal rate, long lifetime and lower grinding resistance.

Specification

Here is a wafer fine grinding example of 8” & 12” Si wafers by #4000/#6000 wafer grinding wheels in-house and by customer. The result indicating lifetime of KINIK wafer grinding wheels with less tip wear is longer than that of competitor’s.

Exxxxx-N2	KINIK	Competitor
Machine	DISCO_840
Current (A)	5~6	5~6
Tip wear (um)	0.3	0.9
Roughness (Ra, um)	0.01	0.01