HomeCompany InformationProductsCustomer ServiceNewsroomInvestor Relations

Diamond-Cu/Diamond-Al Heat Spreader
1. Applications:
“Diamond-copper (DiaCu)” or “Diamond-aluminum (DiaAl)” heat spreaders are applied to high frequency and high power electronic devices. During operation, the generated heat will be effectively dissipated and the temperature of the hot spot will not rise abruptly in an instant. Both materials are thus ideal candidates for heat dissipation modules.
　
2. Characteristics:
At room temperature, diamond’s heat conductivity is five times larger than that of copper. However, natural diamond is not appropriate for mass production of electronic products (e.g. CPU) due to its high price. One alternative is to make use of industrial diamond abrasives as the backbone. Melted metals like copper or aluminum are subsequently penetrated into the space between diamonds. Accordingly, “DiaCu” or “DiaAl” heat spreaders are prepared.
Property
Composition Diamond/Copper Diamond/Aluminum
Coefficient of thermalexpansion (CTE) 2.806 ppm/℃ 5~9 ppm/℃
Thermal Conductivity ~800 W/mK 600~650 W/mK
Specific gravity ~4 3.0~3.2
Metal layer Au/Pt/Ti/Ni/Cu Au/Pt/Ti/Ni/Cu
Dimension Diameter: 51mm (max.) Area: 80mm x 80mm (max.)
Thickness: 1.2mm (min.) Thickness: 1.6mm (min.)
Operating temperature < 500℃ < 300℃
Cladding layer Copper Aluminum
 
3. Microstructure:
According to SEM photographs (Fig. 1), diamond particles were distributed uniformly in copper (left) or aluminum (right) matrix. The whole structure is quite compact and free of voids.

Fig. 1
 
4. Comparison of thermal resistance:
Taking copper as comparative basis, Fig. 2 shows relative thermal resistances of four materials. It is concluded that either for DiaCu or DiaAl, the thermal resistance of diamond-metal composite is obviously smaller than that of pure metal (Cu and Al).
 
5. Product appearance:
DiaCu (Fig. 3, left) and DiaAl (Fig. 3, right) heat spreaders

Fig. 3
 
 
Customer Service：kinik_rd@kinik.com.tw