| 1.
Application： |
The diamond wafer with high
phonon velocity and heat conductance is the best
substrate material for the SAWdeivices in the
high frequency signal transmission in the telecommunication
industry.
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| 2.
Specifications： |
| Silicon substrate |
<1,1,1> |
| Dimension |
3 ~4 inches |
| Thickness |
500~800μm |
| Total thickness variation(TTV) |
< 10
μm |
| Diamond layer |
CVD Polycrystalline diamond |
| Piezo-electrical
layer |
ZnO / Diamond / Si
AIN / Diamond / Si
Diamond / Si
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| Surface Roughness(Ra) |
< 8
nm |
| Bow |
< 40μm |
| Scratch
length |
< 10μm |
| Dig Diameter |
< 10μm |
| Observable flaws |
2 |
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| 3.The morphology of the surface investigated by the AFM.： |
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| 4.
The analysis of the Roman spectrometry shows that it is perfect diamond structure with low residual stress. |
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| 5.
The appearance of our product： |
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| 6.
Summary： |
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The diamond wafer developed by Kinik company can effectively lower the cost of the material and provide high added value transmission quality to create the wonderful future of wireless communication. |
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