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1. Application： |
DiaCu heat spreaders can effectively dissipate the heat generated by the high frequency and high power electronic devices' hot spot.
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2. Features： |
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Property |
Values |
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Composition |
Diamond /
Cu |
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Thermal Expansion Coefficient (CTE) |
2.806
ppm/℃ |
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Heat Conductance |
~800
w/m℃ |
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Specific gravity |
~4 |
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Metal layer |
Au / Pt /
Ti / Ni / Cu |
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Dimension |
Max. dia.
51mm , min thickness 1.2mm |
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Operational Temperature |
(<
500℃) |
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Cladding layer |
Cu |
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3. Microstructure： |
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The SEM photography shows that the diamond particles
are uniformly distributed in the dense copper matrix
without micro voids. |
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4. The heating and cooling test： |
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The test result shows that the heating and cooling
ability of the diamond/copper are superior than copper
at the first 20 mins for the heating and 5 mins for
the cooling |
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6. Summary： |
The high heat dissipation
ability of the diamond/copper materials is a promising
high effectiveness application in the high power
opto-electronics industry and cooling system’s
thermal dissipation module.
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