| |
| |
|
1. Application: |
Diamond Bonding Tools (DBT) is the indispensable tool for the IC package industrial. Such as Inner Bond for chips or Outer Bond for PCB.
|
| |
|
|
| |
| 2.
Property of DBT: |
| a. Side angle
accuracy: 500X |
| |
| b. Surface roughness:
~1nm |
| |
| c. Dimension accuracy: |
- Longitudinal dimension: ± 0.02 ㎜
- Vertical angle: 90° ± 0.1°
- Flatness: 0.00875/10 ㎜/㎜ |
|
| d. Diamond Bonding
Tool : |
| - Well organized diamond structure |
| |
|
| e. Surface morphology: |
| -
Peak value (PV) |
| |
| |
|
| *
Ambient temperature:PV=0.928μm |
*
High temperature:PV=0.094μm |
| |
|
|
|
| 3.
Summary: |
The DBT tools of the Kinik company are the best choice for you TCP/COF and COG bonding process.
|
|
| |
|
| |
|
|
| |